Unlocking the True Power of Additive Manufacturing for EMI Shielding
2024/07/01
2024/07/01
Our latest publication in the IMAPS Journal details a significant development in EMI shielding technology. The Prexonics® inkjet technology enables a shielding effectiveness of over 40 dB with an aspect ratio of 1:1 at a reduced layer thickness of just 2µm. This innovation unlocks substantial ESG benefits for OSATs and OEMs in the semiconductor industry by achieving 99% material efficiency and improving design flexibility compared to traditional PVD coating methods, which require thicker layers, higher aspect ratios and a poor ESG performance
Hanau/Garching, 2024/03/04
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a JDA to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.
Berlin, 2023/10/17
Franz Vollmann, Head of Heraeus Printed Electronics, delivered a presentation at the Techblick conference on the topic “Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating”. Access the presentation slides for detailed information.
San Diego, 2023/10/4
Download the speaker presentation titled ‘Unlocking the True Power of Additive Manufacturing for EMI Shielding,’ presented at the 56th International Symposium on Microelectronics in San Diego.
Taipei, 2021/12/28
The Germany-based company plans to establish its new lab in Tai Yuen Hi-Tech Industrial Park in Zhubei City. The 180 square-meter, state-of-the-art facility will serve as a local application lab for the company and its local partners and is expected to open in the first half of 2022.
Hanau, 2019/09/18
5G is currently on everyone's lips. However, many advantages of the new standard can only be exploited with improved devices. Heraeus offers solutions for the top four technical challenges.
Advancing the Next Challenge in Semiconductor Packaging
Download our brochure and learn more about Heraeus Advanced Packaging Solutions